Introduction
are developed for cleaning mold stains (epoxy resin, organic residues) remaining on mold die surface and in deep cavities during transfer molding process of semiconductor device encapsulation. The application of C60 series eliminates the use of dummy lead frames, and reduces customer costs by simplifying cleaning opera-tion with compression molding.
After many years of modification and development, TecoreTM C60 series were proved excellent cleaning efficiency for indelible mold contamination caused by green epoxy compounds. At the same time, our formulation design also gives high attention to the corrosion protection of the metal plating layers and improves the overall economic benefits of customers.
| Items | Application package | Mold pressure | Mold Temperature [℃] | Optimum cure time [sec] | Recommended Number of shots |
| C60-H | All package | Low clamp pressure | 165～200 | 30～600 | 3～5shots |
| Middle clamp pressure | |||||
| C60-U | High clamp pressure | ||||
| C60-E | LED | Middle clamp pressure | 135～165 | 30～600 | 3～5shots |
Product Performance
Contact us
