Introduction
We develops epoxy molding compounds for BGA/CSP,QFN, and IC cards. The excellent physical and chemical properties of our materials enable semiconductor devices to achieve high reliabilities of MRT, temperature shocking, high temperature, and high current/-voltage, etc.At the same time, Tecore Synchem is also committed to the development of materials with special electrical properties, such ashigh impedance and high dielectric, for advanced el…
Fast-cure Compound for IC Card Module, ET-800C
is a high-performance epoxy molding compound specifically developed for IC card molding.
ET-800C adopts 100% spherical silica and fine filler, and achieves excellent filling performance for ultra-thin encapsulation layer and
narrow structure. The fluidity and curability design of ET-800C enables its good moldability and fast in-mold curing speed (30~40sec in-mold curing time) at the same time.
Contact us
